By BEX Staff for AZBEX
Hyperion Technologies has plans to build a 600KSF semiconductor substrate manufacturing facility in the Vistancia area of Peoria.
According to the company’s website, development on the 45-acre site will create a total economic impact of $6.6B with 1,500 direct jobs. Plant construction is expected to provide 4,500 construction jobs over the development cycle.
Local news outlets cited a statement by the City of Peoria acknowledging there has not yet been a pre-application or site plan application for the project.
The company website says the development will “build a cutting-edge manufacturing facility for high-density interconnect IC substrates.” HDIs are printed circuit boards with higher wiring densities than traditional boards and allow for a greater density of components to be placed in a smaller area. A substrate is a thin slice of material that serves as a supporting material layer where the elements of a semiconductor device are attached.
The website refers to the planned development as a “fully-automated, semiconductor volume fabrication,” and says, “The project will be implemented through a detailed, risk-mitigated, multi-phase approach, with Research and Development of next generation substrates interwoven throughout the four phases to ensure roadmap scalability and innovation. The state-of-the-art, fully automated, 600KSF fabrication facility has a projected capacity of millions of units annually.”
Hyperion claims its substrates serve a diverse set of applications in at least 10 critical infrastructure sectors.
BEX researchers emailed Hyperion to ask about specific project details, including the selection of a design firm and general contractor. The company replied with a boilerplate message saying: “Hyperion Technologies, Inc. is a semiconductor technology innovator in the planning stages of expanding operations into advanced semiconductor interconnect substrate (“IC-Substrate”) fabrication. As the United States works to strengthen domestic semiconductor supply chain resilience and ecosystem comprehensiveness, high-volume availability of IC-substrates continues to stand out as the critical, missing link. Hyperion is committed to establishing a U.S.-based semiconductor fabrication facility to deliver advanced IC-substrates and 3D-integrated circuit solutions at scale. Hyperion is working diligently with its investors, customers, technology partners, state, and local representatives to issue a formal statement outlining our expansion strategy and plans for Hyperion’s first-of-its-kind fabrication facility in the United States.”
